Recently, Samsung Electronics announced the mass production of the industry's thinnest dynamic random-access memory (DRAM) low-power memory chips to meet the growing demand for artificial intelligence (AI) in mobile devices.
Samsung's latest offering includes 12-nanometer (nm) class, 12GB and 16GB LPDDR5X DRAM chips, as thin as a fingernail, marking a significant push from AI technology in driving demand for electronic products.
Leveraging its expertise in chip packaging, Samsung has successfully manufactured ultra-thin LPDDR5X DRAM packages. This design not only creates more space for mobile devices but also improves airflow, aiding more effective thermal management. As high-performance applications and complex functionalities continue to evolve, the importance of thermal management becomes increasingly evident, and Samsung's latest products are well-timed.
Samsung's LPDDR5X DRAM chips also excel in performance. Company executive YongCheol Bae stated in a declaration: "Our LPDDR5X DRAM sets a new standard for high-performance mobile AI solutions, not only superior in LPDDR performance but also achieving advanced thermal management in an ultra-compact package." Samsung is committed to continuous innovation through close collaboration with customers to meet future demands in the low-power DRAM market.
It is noteworthy that Samsung's new LPDDR5X DRAM package features a four-layer stacking structure, reducing thickness by approximately 9% and improving thermal resistance performance by 21.2%, outperforming its predecessor. By optimizing the printed circuit board (PCB) and epoxy molding compound (EMC) technology, the new LPDDR DRAM package achieves a thickness of 0.65 millimeters, making it the thinnest in the market for 12GB and above LPDDR DRAM, further enhancing its competitiveness.
In the future, Samsung plans to supply the 0.65-millimeter LPDDR5X DRAM to mobile processor manufacturers and mobile device manufacturers, continuously expanding the low-power DRAM market. With the growing demand for high-performance, high-density mobile memory solutions and smaller package sizes, Samsung also plans to develop 6-layer 24GB and 8-layer 32GB modules to introduce even thinner LPDDR DRAM products to meet future device demands.
Key Points:
🌟 Samsung begins mass production of ultra-thin LPDDR5X DRAM chips to meet AI demands in mobile devices.
📏 The new memory is only 0.65 millimeters thick, thinner than its predecessor, with significantly improved thermal resistance performance.
📈 Samsung plans to expand the low-power DRAM market, introducing more high-performance, high-density memory solutions.