As reported by Zhanchangzhijia on October 10, supply chain sources reveal that NVIDIA is preparing to launch its next-generation AI chip architecture, codenamed B100, in the coming year. The B100 is expected to utilize TSMC's latest 4-nanometer process technology and integrate two GPU cores along with eight high-bandwidth memory (HBM) modules, which will enhance the demand for NVIDIA's advanced CoWoS (Chip on Wafer on Substrate) packaging technology in the AI chip sector. The report indicates that NVIDIA is receiving CoWoS capacity support from both TSMC and backend packaging and testing companies, which will improve future production visibility. Industry insiders predict that with the continuous expansion of CoWoS capacity, the shipment volume of NVIDIA's AI chips will increase, in turn stimulating further growth in CoWoS demand. Analysts believe that the introduction of the new B100 architecture will accelerate NVIDIA's development in AI chips and also drive further advancements in packaging technologies such as CoWoS.