Translated data: German company Semron secures $7.9 million in funding to drive innovation in AI chips for mobile devices. By employing 3D packaging technology, Semron anticipates a 20-fold increase in chip efficiency. Its CapRAM technology, which utilizes variable capacitors to construct a unique semiconductor architecture, enables AI models to operate with a volume 1000 times larger. With the infusion of funds, Semron plans to enhance hardware and compiler development, expand its team, and focus on internationalization, aiming to become a leading innovator in the field of AI chips for smart devices.