["1、博通在ECOC 2023上发布5纳米200G/通道PAM芯片BCM85822","2、该芯片集成激光驱动器,采用PAM-4调制,性能领先","3、BCM85822可实现51.2T交换容量,提升数据中心网络密度","4、新芯片助力实现电气和光纤均为200G的目标","5、BCM85822有助AI工作负载从800G迁移到1.6T"]