Supply chain sources indicate that NVIDIA will launch a new generation AI chip architecture, B100, next year. The B100 is expected to utilize a 4-nanometer process integrating 2 GPUs and 8 HBM, which will enhance the demand for CoWoS packaging. NVIDIA has gained support for CoWoS capacity from TSMC and backend OSAT, improving future production visibility. As CoWoS capacity expands, NVIDIA's AI chip shipment volume will increase, further stimulating CoWoS demand growth. Analysts believe that NVIDIA's new architecture will benefit the development of its AI chips and also promote advancements in packaging technologies such as CoWoS.