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Samsung Electronics' fifth-generation high bandwidth memory (HBM) chip, HBM3E, has passed Nvidia's testing and is qualified for use in artificial intelligence processors. Although the two parties have yet to sign a formal agreement, a supply agreement is expected to be reached soon, with supply anticipated to begin in the fourth quarter of 2024. This achievement represents a key breakthrough for Samsung in competing with local rival SK Hynix. However, Samsung's 12-layer HBM3E chip failed to pass testing, prompting the company to make adjustments to the design in order to address issues related to heat and power consumption.

Micron Technology has achieved revenue growth for six consecutive quarters, primarily due to the surge in demand for AI chips. The company's newly launched HBM3E memory chip modules have been well received and are expected to generate hundreds of millions in revenue for the company in 2024. Micron is optimistic about the applications of AI in personal computers and mobile devices, planning to increase capital expenditures in fiscal year 2024 to meet production demands for the new memory modules. The CEO stated that the company’s HBM supply is sold out and predicts a significant increase in sales in the personal computer sector in 2024, driving demand for memory and storage.

["Samsung confirms that the codename for the fifth generation HBM3E memory is Shinebolt, with a 50% bandwidth increase to 1.228TB.","Shinebolt will stack 24Gb chips in 8 layers, and a 12-layer 36GB product is under development.","HBM3E will provide strong support for the next generation of AI GPUs.","Samsung accelerates HBM3E development, closely following industry leader SK Hynix.","Samsung announces plans to further expand HBM production capacity to offer customized services to customers."]