German company Semron successfully raised $7.9 million to promote AI chip innovation for mobile devices. Semron employs advanced 3D packaging technology, expecting to enhance efficiency by up to 20 times. The CapRAM technology utilizes variable capacitors to construct a unique semiconductor architecture, allowing for AI models with a volume up to 1000 times larger. With this funding, Semron plans to strengthen hardware and compiler development, expand its team, and focus on internationalization. Semron aims to become a leader in AI chip innovation for smart devices.