IBM's next-generation Co-Packaged Optics (CPO) technology is a groundbreaking optical solution designed to connect chips, circuit boards, and servers within data centers using light instead of electricity. This enhances bandwidth, reduces energy consumption, and accelerates the training and operation of AI models. CPO technology significantly increases communication bandwidth in data centers, reduces GPU idle time, and dramatically speeds up AI processing. It represents a new paradigm in data center communication, helping to meet the growing energy and processing demands of generative AI.